Ansys (ANSS) electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand ...

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...

Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...

Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...

Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes Ansys® RedHawk-SC™ was added to the certified suite to design ...

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...

The ANSYS Elite channel partner program is designed to promote customer success by ensuring that channel partners meet stringent certification and resource requirements. While requirements vary by ...

PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...